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1 Ergebnisse
1
TSPC Trigger-Based Testing Scheme for Pre-Bond Testing and ..:
, In:
2023 2nd International Conference on Sensing, Measurement, Communication and Internet of Things Technologies (SMC-IoT)
,
Yu, Yang
;
Su, Jingqiao
;
Xu, Hongshui
. - p. 11-17 , 2023
Link:
https://doi.org/10.1109/SMC-IoT62253.2023.00010
RT T1
2023 2nd International Conference on Sensing, Measurement, Communication and Internet of Things Technologies (SMC-IoT)
: T1
TSPC Trigger-Based Testing Scheme for Pre-Bond Testing and Diagnosis of TSVs
UL https://suche.suub.uni-bremen.de/peid=ieee-10538604&Exemplar=1&LAN=DE A1 Yu, Yang A1 Su, Jingqiao A1 Xu, Hongshui A1 Xiao, Ziwen YR 2023 K1 Location awareness K1 Fabrication K1 Three-dimensional displays K1 Hardware K1 Sensors K1 Internet of Things K1 Through-silicon vias K1 TSV K1 Pre-Bond Testing K1 Design for testability SP 11 OP 17 LK http://dx.doi.org/https://doi.org/10.1109/SMC-IoT62253.2023.00010 DO https://doi.org/10.1109/SMC-IoT62253.2023.00010 SF ELIB - SuUB Bremen
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