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1
A Case of Plasma-Induced Film Breakdown in 3D NAND BEOL Die..:
, In:
2024 35th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)
,
Liang, Ying-Hung
;
Chiu, Yuan-Chieh
;
Yang, Zusing
... - p. 1-4 , 2024
Link:
https://doi.org/10.1109/ASMC61125.2024.10545363
RT T1 <cTitle>2024 35th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)</cTitle>: T1 <Title>A Case of Plasma-Induced Film Breakdown in 3D NAND BEOL Dielectric Etch</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10545363&Exemplar=1&LAN=DE A1 Liang, Ying-Hung A1 Chiu, Yuan-Chieh A1 Yang, Zusing A1 Lee, Hong-Ji A1 Lian, Nan-Tzu A1 Yang, Tahone A1 Chen, Kuang-Chao A1 Lu, Chih-Yuan YR 2024 SN 2376-6697 K1 Three-dimensional displays K1 Electric breakdown K1 Metals K1 Semiconductor device manufacture K1 Product development K1 Stability analysis K1 Product design K1 3D NAND K1 Via ETCH K1 Arcing K1 Film damaged defects SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/ASMC61125.2024.10545363 DO https://doi.org/10.1109/ASMC61125.2024.10545363 SF ELIB - SuUB Bremen
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