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1 Ergebnisse
1
Critical Defect Detection at 3nm Technology Node: Enhanced ..:
, In:
2024 35th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)
,
Chiu, Shao-Chien
;
Peng, Mark
;
Wei, Yuan-Chung
... - p. 1-5 , 2024
Link:
https://doi.org/10.1109/ASMC61125.2024.10545367
RT T1 <cTitle>2024 35th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)</cTitle>: T1 <Title>Critical Defect Detection at 3nm Technology Node: Enhanced Detection Using DUV Optical Inspection Technology With AI-Based Algorithm</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10545367&Exemplar=1&LAN=DE A1 Chiu, Shao-Chien A1 Peng, Mark A1 Wei, Yuan-Chung A1 Cheng, Kai-Yuan A1 Chen, To-Yu A1 Chou, Heng-Yu A1 Wu, Meng-Che A1 Su, Kuan Hua A1 Shushan, Nofar A1 Mizrahi, Assaf A1 Maurya, Sidharth A1 Danieli, Guy A1 Reut, Gilad YR 2024 SN 2376-6697 K1 Scanning electron microscopy K1 Electric potential K1 Costs K1 Reviews K1 Inspection K1 Semiconductor device manufacture K1 Benchmark testing K1 Yield K1 Defect Metrology K1 OPWI K1 DUV K1 Brightfield K1 Capture Rate K1 False Alarm Rate K1 AI SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/ASMC61125.2024.10545367 DO https://doi.org/10.1109/ASMC61125.2024.10545367 SF ELIB - SuUB Bremen
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