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1 Ergebnisse
1
Too Hot to Handle: Novel Thermal Side-Channel in Power Atta..:
, In:
2024 IEEE International Symposium on Hardware Oriented Security and Trust (HOST)
,
Mishra, Nimish
;
Dutta, Tridib Lochan
;
Shukla, Shubhi
.. - p. 378-382 , 2024
Link:
https://doi.org/10.1109/HOST55342.2024.10545405
RT T1 <cTitle>2024 IEEE International Symposium on Hardware Oriented Security and Trust (HOST)</cTitle>: T1 <Title>Too Hot to Handle: Novel Thermal Side-Channel in Power Attack-Protected Intel Processors</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10545405&Exemplar=1&LAN=DE A1 Mishra, Nimish A1 Dutta, Tridib Lochan A1 Shukla, Shubhi A1 Chakraborty, Anirban A1 Mukhopadhyay, Debdeep YR 2024 SN 2765-8406 K1 Program processors K1 Power measurement K1 Power demand K1 Side-channel attacks K1 Thermal sensors K1 Fingerprint recognition K1 Software K1 Running Average Power Limit (RAPL) K1 Soft-ware power side-channels K1 Software thermal side-channels SP 378 OP 382 LK http://dx.doi.org/https://doi.org/10.1109/HOST55342.2024.10545405 DO https://doi.org/10.1109/HOST55342.2024.10545405 SF ELIB - SuUB Bremen
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