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1 Ergebnisse
1
Copper Electromigration Improvement Through Aluminum Barrie..:
, In:
2024 35th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)
,
Sahoo, P B
;
Hadi, Harri Dharma
;
Afiq, Amirul
... - p. 1-3 , 2024
Link:
https://doi.org/10.1109/ASMC61125.2024.10545438
RT T1 <cTitle>2024 35th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)</cTitle>: T1 <Title>Copper Electromigration Improvement Through Aluminum Barrier and Related Process Optimization</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10545438&Exemplar=1&LAN=DE A1 Sahoo, P B A1 Hadi, Harri Dharma A1 Afiq, Amirul A1 Jun, Xie A1 Yee, Chong Chia A1 Hian, Tan Tze A1 Daiyu, Huang A1 Zheng, Peck Yan YR 2024 SN 2376-6697 K1 Electromigration K1 Aluminum K1 Failure analysis K1 Semiconductor device manufacture K1 Reliability K1 Copper K1 Optimization K1 Copper electromigration (EM) K1 Cu-Al interface K1 barrier metal K1 Aluminum Cap K1 Cu migration K1 Cu diffusion barrier SP 1 OP 3 LK http://dx.doi.org/https://doi.org/10.1109/ASMC61125.2024.10545438 DO https://doi.org/10.1109/ASMC61125.2024.10545438 SF ELIB - SuUB Bremen
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