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1 Ergebnisse
1
UPC Fault Reduction via CPEC Backside Surface Roughness Con..:
, In:
2024 35th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)
,
Ooi, Zeen Vee
;
Tan, Cheng Wei Alvin
;
Lim, Chin Teck
.. - p. 1-5 , 2024
Link:
https://doi.org/10.1109/ASMC61125.2024.10545446
RT T1 <cTitle>2024 35th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)</cTitle>: T1 <Title>UPC Fault Reduction via CPEC Backside Surface Roughness Control</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10545446&Exemplar=1&LAN=DE A1 Ooi, Zeen Vee A1 Tan, Cheng Wei Alvin A1 Lim, Chin Teck A1 Peng, Murong A1 Koh, Chuah YR 2024 SN 2376-6697 K1 Semiconductor device measurement K1 Seals K1 Semiconductor device manufacture K1 Market research K1 Surface roughness K1 Rough surfaces K1 Helium K1 UPC fault K1 Novellus SPEED™ K1 precoat K1 CPEC K1 roughness SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/ASMC61125.2024.10545446 DO https://doi.org/10.1109/ASMC61125.2024.10545446 SF ELIB - SuUB Bremen
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