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In-house Test Wafer Reclaim for Fab Cost and Wastage Reduct..:

, In: 2024 35th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC),

Dong, Xinqiao ; Mukherjee, Subhadeep ; Asokan, Monicka.. - p. 1-7 , 2024

Link: https://doi.org/10.1109/ASMC61125.2024.10545463

RT 
T1 <cTitle>2024 35th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)</cTitle>: T1 <Title>In-house Test Wafer Reclaim for Fab Cost and Wastage Reduction: MS: Manufacturing for Sustainability</Title>

UL https://suche.suub.uni-bremen.de/peid=ieee-10545463&Exemplar=1&LAN=DE
				
A1 Dong, Xinqiao
A1 Mukherjee, Subhadeep
A1 Asokan, Monicka
A1 Yang, Yi
A1 Duvvuru, Vivek
YR 2024
SN 2376-6697
K1 Silicon compounds
K1 Fabrication
K1 Waste reduction
K1 Costs
K1 Semiconductor device manufacture
K1 Silicon
K1 Cleaning
K1 CMP (Chemical Mechanical Polishing)
K1 wafer fabrication
K1 replacement gate (RG)
K1 cost per wafer (CPW)
K1 elimination
K1 Negative Time Delay (NTDEL)
K1 Smart Spray Rinse (SSR)
K1 Process of Record (POR)
K1 Real-Time defect Analysis (RDA)
K1 Total Random Defects (TRD)
K1 Total Cluster Defects (TCD)
K1 Actual Total Defects (ATD)
SP 1
OP 7
LK http://dx.doi.org/https://doi.org/10.1109/ASMC61125.2024.10545463
DO https://doi.org/10.1109/ASMC61125.2024.10545463
SF ELIB - SuUB Bremen

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