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1 Ergebnisse
1
Q-time Assessment on Electroplated Nickel/Gold Interface Qu..:
, In:
2024 35th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)
,
Paul, Sanjoy
;
Hedrick, Brittany
;
Abdel-Aziz, Ahmed
... - p. 01-03 , 2024
Link:
https://doi.org/10.1109/ASMC61125.2024.10545502
RT T1 <cTitle>2024 35th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)</cTitle>: T1 <Title>Q-time Assessment on Electroplated Nickel/Gold Interface Quality</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10545502&Exemplar=1&LAN=DE A1 Paul, Sanjoy A1 Hedrick, Brittany A1 Abdel-Aziz, Ahmed A1 Garant, John A1 Yatzor, Brett A1 Schroiff, Christian A1 Yuan, Qin YR 2024 SN 2376-6697 K1 Electrochemical deposition K1 Gold K1 Adhesives K1 Plating K1 Semiconductor device manufacture K1 Nickel K1 Oxidation K1 Electroplating K1 Electrical interconnects K1 Metal oxidation K1 Metal interfaces SP 01 OP 03 LK http://dx.doi.org/https://doi.org/10.1109/ASMC61125.2024.10545502 DO https://doi.org/10.1109/ASMC61125.2024.10545502 SF ELIB - SuUB Bremen
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