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1 Ergebnisse
1
Optimization of O2 Plasma After Silicon Etch Process to Pre..:
, In:
2024 35th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)
,
Kang, Junseok
;
Yang, Ki Dong
;
Sinn, Soobin
... - p. 1-4 , 2024
Link:
https://doi.org/10.1109/ASMC61125.2024.10545505
RT T1 <cTitle>2024 35th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)</cTitle>: T1 <Title>Optimization of O2 Plasma After Silicon Etch Process to Prevent Br-Induced Equipment Corrosion and Pattern Abnormality</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10545505&Exemplar=1&LAN=DE A1 Kang, Junseok A1 Yang, Ki Dong A1 Sinn, Soobin A1 Gim, Gyuwon A1 Park, Hanbit A1 Hwang, Wookyoung A1 Han, Eunyoung A1 Kim, Young Jeong A1 Kim, Joong Jung YR 2024 SN 2376-6697 K1 Degradation K1 Corrosion K1 Instruments K1 Hydrogen K1 Bromine compounds K1 Moisture K1 Semiconductor device manufacture K1 Hydrogen bromide K1 equipment corrosion K1 post-etch treatment K1 pattern abnormality SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/ASMC61125.2024.10545505 DO https://doi.org/10.1109/ASMC61125.2024.10545505 SF ELIB - SuUB Bremen
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