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1 Ergebnisse
1
A New Ultra-Low Voltage Metal Fuse for High Density OTP App..:
, In:
2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA)
,
Wang, Li-Yu
;
Chen, Kuan-Ju
;
Yuh, Perng-Fei
... - p. 1-2 , 2024
Link:
https://doi.org/10.1109/VLSITSA60681.2024.10546348
RT T1 <cTitle>2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA)</cTitle>: T1 <Title>A New Ultra-Low Voltage Metal Fuse for High Density OTP Applications</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10546348&Exemplar=1&LAN=DE A1 Wang, Li-Yu A1 Chen, Kuan-Ju A1 Yuh, Perng-Fei A1 Wang, Yih A1 Chang, Jonathan A1 King, Ya-Chin A1 Lin, Chrong Jung YR 2024 K1 Geometry K1 Temperature distribution K1 Technological innovation K1 Three-dimensional displays K1 Fuses K1 Microprocessors K1 Computer architecture SP 1 OP 2 LK http://dx.doi.org/https://doi.org/10.1109/VLSITSA60681.2024.10546348 DO https://doi.org/10.1109/VLSITSA60681.2024.10546348 SF ELIB - SuUB Bremen
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