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1 Ergebnisse
1
Co Metal ALD on Cu with Cyclic Clean by Peroxide and Hydraz..:
, In:
2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA)
,
Kuo, Cheng-Hsuan
;
Pal, Dipayan
;
Wang, Victor
... - p. 1-2 , 2024
Link:
https://doi.org/10.1109/VLSITSA60681.2024.10546373
RT T1 <cTitle>2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA)</cTitle>: T1 <Title>Co Metal ALD on Cu with Cyclic Clean by Peroxide and Hydrazine for Inverse Hybrid Metal Bonding</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10546373&Exemplar=1&LAN=DE A1 Kuo, Cheng-Hsuan A1 Pal, Dipayan A1 Wang, Victor A1 Manley, Madison A1 Sahay, Rohan A1 Kanjolia, Ravindra A1 Moinpour, Mansour A1 Woodruff, Jacob A1 Muhannad, Bakir A1 Spiegelman, Jeff A1 Kummel, Andrew C. YR 2024 K1 Micrometers K1 Three-dimensional displays K1 Limiting K1 High performance computing K1 Very large scale integration K1 Delays K1 Flip-chip devices SP 1 OP 2 LK http://dx.doi.org/https://doi.org/10.1109/VLSITSA60681.2024.10546373 DO https://doi.org/10.1109/VLSITSA60681.2024.10546373 SF ELIB - SuUB Bremen
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