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1 Ergebnisse
1
Advanced Chip on Wafer Hybrid Bonding with Copper/Polymer B..:
, In:
2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA)
,
Ouyang, Tsung- Yu
;
Lin, Yu-Min
;
Chan, Yu-Ping
... - p. 1-2 , 2024
Link:
https://doi.org/10.1109/VLSITSA60681.2024.10546425
RT T1 <cTitle>2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA)</cTitle>: T1 <Title>Advanced Chip on Wafer Hybrid Bonding with Copper/Polymer Base Adhesive</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10546425&Exemplar=1&LAN=DE A1 Ouyang, Tsung- Yu A1 Lin, Yu-Min A1 Chan, Yu-Ping A1 Lee, Ou-Hsiang. A1 Lee, Ching-Kuan A1 Chang, Hsiang-Hung A1 Wang, Chin-Hung A1 Lo, Wei-Chung A1 Chuang, Po- Yao A1 Tseng, Ying-Chung A1 Tsai, Po-Hao A1 Gallagher, Michael A1 Gilmore, Christopher YR 2024 K1 Temperature sensors K1 Thermal expansion K1 Temperature K1 Sensitivity K1 Dielectric materials K1 Very large scale integration K1 Polymers SP 1 OP 2 LK http://dx.doi.org/https://doi.org/10.1109/VLSITSA60681.2024.10546425 DO https://doi.org/10.1109/VLSITSA60681.2024.10546425 SF ELIB - SuUB Bremen
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