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1 Ergebnisse
1
Device Engineering and Benefit Maximization for Advanced Cr..:
, In:
2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA)
,
Chiang, Hung-Li
;
Wu, Jui-Jen
;
Liao, Pei-Jun
... - p. 1-2 , 2024
Link:
https://doi.org/10.1109/VLSITSA60681.2024.10546444
RT T1 <cTitle>2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA)</cTitle>: T1 <Title>Device Engineering and Benefit Maximization for Advanced Cryo-CMOS</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10546444&Exemplar=1&LAN=DE A1 Chiang, Hung-Li A1 Wu, Jui-Jen A1 Liao, Pei-Jun A1 Chen, Tzu-Chiang A1 Chang, Chih-Sheng A1 Bao, Xinyu A1 Cai, Jin A1 Chang, Marvin F. A1 Chuang, Harry A1 Diaz, Carlos H. A1 Wong, H.-S. Philip A1 Passlack, Matthias A1 Radu, Iuliana YR 2024 K1 Thermal factors K1 Switches K1 Very large scale integration K1 Threshold voltage K1 Tunneling magnetoresistance K1 Transistors K1 Junctions SP 1 OP 2 LK http://dx.doi.org/https://doi.org/10.1109/VLSITSA60681.2024.10546444 DO https://doi.org/10.1109/VLSITSA60681.2024.10546444 SF ELIB - SuUB Bremen
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