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1 Ergebnisse
1
3D-Integrated, Low Power, High Bandwidth Density Opto-Elect..:
, In:
2024 IEEE International Symposium on Circuits and Systems (ISCAS)
,
Khilwani, Devesh
;
Lee, Sunwoo
;
Ou, Christine
... - p. 1-5 , 2024
Link:
https://doi.org/10.1109/ISCAS58744.2024.10558323
RT T1
2024 IEEE International Symposium on Circuits and Systems (ISCAS)
: T1
3D-Integrated, Low Power, High Bandwidth Density Opto-Electronic Transceiver
UL https://suche.suub.uni-bremen.de/peid=ieee-10558323&Exemplar=1&LAN=DE A1 Khilwani, Devesh A1 Lee, Sunwoo A1 Ou, Christine A1 Daudlin, Stuart A1 Rizzo, Anthony A1 Wang, Songli A1 Cullen, Michael A1 Bergman, Keren A1 Molnar, Alyosha YR 2024 SN 2158-1525 K1 Transmitters K1 Modulation K1 Bandwidth K1 Receivers K1 Packaging K1 Silicon photonics K1 Transceivers K1 Gigabit wireline K1 Bandwidth density K1 Flipchip packaging SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/ISCAS58744.2024.10558323 DO https://doi.org/10.1109/ISCAS58744.2024.10558323 SF ELIB - SuUB Bremen
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