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1 Ergebnisse
1
A Ka- to W-Band Tightly Coupled Array Antenna-in-Package Us..:
, In:
2024 IEEE International Symposium on Circuits and Systems (ISCAS)
,
Chiang, Ching-Wen
;
Khiabani, Neda
;
Gao, Donglin
... - p. 1-5 , 2024
Link:
https://doi.org/10.1109/ISCAS58744.2024.10558344
RT T1 <cTitle>2024 IEEE International Symposium on Circuits and Systems (ISCAS)</cTitle>: T1 <Title>A Ka- to W-Band Tightly Coupled Array Antenna-in-Package Using Glass IPD for Ultrawideband mmWave Wireless Communication</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10558344&Exemplar=1&LAN=DE A1 Chiang, Ching-Wen A1 Khiabani, Neda A1 Gao, Donglin A1 Kuo, Chien-Nan A1 Kuan, Yen-Cheng A1 Wu, Chung-Tse Michael YR 2024 SN 2158-1525 K1 Printed circuits K1 RF signals K1 Antenna-in-package K1 Bandwidth K1 Ultra wideband antennas K1 Broadband communication K1 Impedance K1 Tightly coupled array (TCA) K1 antenna-in-package (AiP) K1 ultrawideband K1 millimeter-wave (mmWave) K1 integrated passive device (IPD) K1 metamaterial (MTM) K1 beyound 5G (B5G) K1 6G K1 wireless communication SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/ISCAS58744.2024.10558344 DO https://doi.org/10.1109/ISCAS58744.2024.10558344 SF ELIB - SuUB Bremen
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