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1 Ergebnisse
1
Flexible Integrated Circuits via Stress-minimized Layout an..:
, In:
2024 IEEE International Symposium on Circuits and Systems (ISCAS)
,
Wang, Muyao
;
Wang, Bo
;
Jia, Lu
.. - p. 1-4 , 2024
Link:
https://doi.org/10.1109/ISCAS58744.2024.10558471
RT T1 <cTitle>2024 IEEE International Symposium on Circuits and Systems (ISCAS)</cTitle>: T1 <Title>Flexible Integrated Circuits via Stress-minimized Layout and Ultra-thin Chip</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10558471&Exemplar=1&LAN=DE A1 Wang, Muyao A1 Wang, Bo A1 Jia, Lu A1 Li, Haicheng A1 Feng, Xue YR 2024 SN 2158-1525 K1 Integrated circuits K1 Wireless sensor networks K1 Deformation K1 Layout K1 Data acquisition K1 Electronic packaging thermal management K1 Real-time systems K1 flexible integrated circuit K1 ultra-thin chip K1 systemin-package K1 data acquisition system K1 flexible electronics SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/ISCAS58744.2024.10558471 DO https://doi.org/10.1109/ISCAS58744.2024.10558471 SF ELIB - SuUB Bremen
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