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1 Ergebnisse
1
Electrical-Thermal Multiphysical Analysis of On-Chip Power ..:
, In:
2024 IEEE International Conference on Computational Electromagnetics (ICCEM)
,
Li, Shang
;
Jiang, Linghai
;
Zhou, Xiaoxin
. - p. 1-3 , 2024
Link:
https://doi.org/10.1109/ICCEM60619.2024.10558882
RT T1 <cTitle>2024 IEEE International Conference on Computational Electromagnetics (ICCEM)</cTitle>: T1 <Title>Electrical-Thermal Multiphysical Analysis of On-Chip Power Grid</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10558882&Exemplar=1&LAN=DE A1 Li, Shang A1 Jiang, Linghai A1 Zhou, Xiaoxin A1 Wan, Ting YR 2024 SN 2768-2552 K1 Performance evaluation K1 Three-dimensional displays K1 Power demand K1 Integrated circuit interconnections K1 Thermal conductivity K1 Power grids K1 System-on-chip K1 On-Chip Power Grid K1 multiphysical field analysis finite element analysis K1 electrical-thermal co-simulation SP 1 OP 3 LK http://dx.doi.org/https://doi.org/10.1109/ICCEM60619.2024.10558882 DO https://doi.org/10.1109/ICCEM60619.2024.10558882 SF ELIB - SuUB Bremen
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