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1 Ergebnisse
1
Novel Single and Co-Ion Implantation Induced Backside Etch ..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Chen, Yen-Shuo
;
Chiu, Tzu-Wei
;
Fan, Hua-Tai
... - p. 2184-2188 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00371
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Novel Single and Co-Ion Implantation Induced Backside Etch Stop Structures for 3D Multilayer Stacked Package</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10564832&Exemplar=1&LAN=DE A1 Chen, Yen-Shuo A1 Chiu, Tzu-Wei A1 Fan, Hua-Tai A1 Ko, Yu-Chien A1 Chen, Chu-Chi A1 Ko, Fu-Hsiang YR 2024 SN 2377-5726 K1 Water K1 Solvents K1 Semiconductor device measurement K1 Boron K1 Three-dimensional displays K1 Process control K1 Etching K1 single-ions doped K1 co-ions doped K1 pure solvent K1 hybrid solvents K1 retarding etching rate SP 2184 OP 2188 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00371 DO https://doi.org/10.1109/ECTC51529.2024.00371 SF ELIB - SuUB Bremen
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