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1 Ergebnisse
1
D2W Hybrid Bonding System Achieving High-Accuracy and High-..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Mihara, Kentaro
;
Hare, Takashi
;
Sakai, Hirofumi
... - p. 420-426 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00074
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>D2W Hybrid Bonding System Achieving High-Accuracy and High-Throughput With Minimal Configurations</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10564833&Exemplar=1&LAN=DE A1 Mihara, Kentaro A1 Hare, Takashi A1 Sakai, Hirofumi A1 Aoki, Shimpei A1 Terada, Toyoharu A1 Murugesan, Mariappan A1 Hashimoto, Hiryuki A1 Kino, Hisashi A1 Tanaka, Tetsu A1 Fukushima, Takafumi A1 Inoue, Fumihiro A1 Uedono, Akira YR 2024 SN 2377-5726 K1 Plasma properties K1 Spectroscopy K1 Particle beams K1 Accuracy K1 Kelvin K1 Electronic components K1 Positrons K1 D2W hybrid bonding K1 high-throughput K1 high-accuracy K1 H2O plasma K1 PAS K1 DCBM SP 420 OP 426 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00074 DO https://doi.org/10.1109/ECTC51529.2024.00074 SF ELIB - SuUB Bremen
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