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1 Ergebnisse
1
A Study of Low Temperature SoIC Targeting 200 nm Bond Pitch:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Wang, Wei-Ming
;
Yeh, C.W.
;
Chia, Han-Jong
... - p. 765-770 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00125
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>A Study of Low Temperature SoIC Targeting 200 nm Bond Pitch</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10564855&Exemplar=1&LAN=DE A1 Wang, Wei-Ming A1 Yeh, C.W. A1 Chia, Han-Jong A1 Tsui, R.F. A1 Cui, Ji James A1 Tung, Chih-Hang A1 Yee, Kuo-Chung A1 Yu, Douglas C.H. YR 2024 SN 2377-5726 K1 Temperature distribution K1 Three-dimensional displays K1 Generative AI K1 Metals K1 Bandwidth K1 Routing K1 Energy efficiency K1 3DIC K1 SoIC K1 AI K1 HPC K1 EEP K1 ultra high bond density K1 sub-micron pitch K1 chiplets integration K1 wafer-on-wafer K1 system integration K1 heterogeneous integration SP 765 OP 770 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00125 DO https://doi.org/10.1109/ECTC51529.2024.00125 SF ELIB - SuUB Bremen
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