I agree that this site is using cookies. You can find further informations
here
.
X
Login
Merkliste (
0
)
Home
About us
Home About us
Our history
Profile
Press & public relations
Friends
The library in figures
Exhibitions
Projects
Training, internships, careers
Films
Services & Information
Home Services & Information
Lending and interlibrary loans
Returns and renewals
Training and library tours
My Account
Library cards
New to the library?
Download Information
Opening hours
Learning spaces
PC, WLAN, copy, scan and print
Catalogs and collections
Home Catalogs and Collections
Rare books and manuscripts
Digital collections
Subject Areas
Our sites
Home Our sites
Central Library
Law Library (Juridicum)
BB Business and Economics (BB11)
BB Physics and Electrical Engineering
TB Engineering and Social Sciences
TB Economics and Nautical Sciences
TB Music
TB Art & Design
TB Bremerhaven
Contact the library
Home Contact the library
Staff Directory
Open access & publishing
Home Open access & publishing
Reference management: Citavi & RefWorks
Publishing documents
Open Access in Bremen
zur Desktop-Version
Toggle navigation
Merkliste
1 Ergebnisse
1
Investigation of Distortion in Wafer-to-wafer Bonding with ..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Kang, Shuo
;
Iacovo, Serena
;
D'have, Koen
... - p. 386-393 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00069
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Investigation of Distortion in Wafer-to-wafer Bonding with Highly Bowed Wafers</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10564867&Exemplar=1&LAN=DE A1 Kang, Shuo A1 Iacovo, Serena A1 D'have, Koen A1 Huylenbroeck, Stefaan Van A1 Orkut Okudur, Oguzhan A1 Alexeev, Anton A1 Plach, Thomas A1 Probst, Gernot A1 Ding, Taotao A1 Wimplinger, Markus A1 Uhrmann, Thomas A1 Vos, Joeri De A1 Beyer, Gerald A1 Beyne, Eric YR 2024 SN 2377-5726 K1 Performance evaluation K1 Shape K1 Lithography K1 Metrology K1 Fingerprint recognition K1 Distortion K1 Market research K1 wafer bonding K1 high bow K1 wafer bonding overlay K1 backside lithography overlay K1 grid distortion K1 scanner metrology SP 386 OP 393 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00069 DO https://doi.org/10.1109/ECTC51529.2024.00069 SF ELIB - SuUB Bremen
Export
RefWorks (nur Desktop-Version!)
Flow
(Zuerst in
Flow
einloggen, dann importieren)
