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1 Ergebnisse
1
Adhesion Layer Influence on Thermomechanical Reliability of..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Yang, Junbo
;
Pan, Ke
;
Yin, Pengcheng
... - p. 1820-1825 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00304
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Adhesion Layer Influence on Thermomechanical Reliability of Electroplated Copper Through-Glass Via (TGV)</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10564869&Exemplar=1&LAN=DE A1 Yang, Junbo A1 Pan, Ke A1 Yin, Pengcheng A1 Lai, Yangyang A1 Park, Seungbae A1 Okoro, Chukwudi A1 Joshi, Dhananjay A1 Pollard, Scott YR 2024 SN 2377-5726 K1 Adhesives K1 Deformation K1 Creep K1 Two-dimensional displays K1 Glass K1 Optical variables measurement K1 Numerical models K1 Through glass via (TGV) K1 creep K1 time hardening model K1 thermomechanical reliability SP 1820 OP 1825 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00304 DO https://doi.org/10.1109/ECTC51529.2024.00304 SF ELIB - SuUB Bremen
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