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Thermomechanical Degradation of Sintered Copper under High-..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Paret, Paul
;
Bhogaraju, Sri Krishna
;
Busse, Dirk
... - p. 1219-1224 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00196
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Thermomechanical Degradation of Sintered Copper under High-Temperature Thermal Shock</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10564871&Exemplar=1&LAN=DE A1 Paret, Paul A1 Bhogaraju, Sri Krishna A1 Busse, Dirk A1 Dahlbudding, Alexander A1 Elger, Gordon A1 Narumanchi, Sreekant YR 2024 SN 2377-5726 K1 Performance evaluation K1 Degradation K1 Temperature sensors K1 Temperature measurement K1 Scanning electron microscopy K1 Thermomechanical processes K1 Sintering K1 sintered copper K1 reliability K1 thermal shock K1 image denoising K1 power electronics modules SP 1219 OP 1224 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00196 DO https://doi.org/10.1109/ECTC51529.2024.00196 SF ELIB - SuUB Bremen
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