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1 Ergebnisse
1
BGA electromigration behavior and why it has become the bot..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Labie, Riet
;
Nawghane, Chinmay
;
Tsiakos, Dimitrios
... - p. 678-684 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00111
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>BGA electromigration behavior and why it has become the bottleneck</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10564874&Exemplar=1&LAN=DE A1 Labie, Riet A1 Nawghane, Chinmay A1 Tsiakos, Dimitrios A1 Mertens, Jan A1 Tremble, Eric A1 Graf, Richard A1 Sauter, Wolfgang YR 2024 SN 2377-5726 K1 Electromigration K1 Power demand K1 Loading K1 Machine learning K1 Threshold current K1 Thermal loading K1 Reliability K1 BGA K1 failure mechanism K1 reliability SP 678 OP 684 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00111 DO https://doi.org/10.1109/ECTC51529.2024.00111 SF ELIB - SuUB Bremen
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