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1 Ergebnisse
1
3.5D Advanced Packaging Enabling Heterogenous Integration o..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Mandalapu, Chandra Sekhar
;
Buch, Chintan
;
Shah, Priyal
... - p. 798-802 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00391
RT T1
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
: T1
3.5D Advanced Packaging Enabling Heterogenous Integration of HPC and AI Accelerators
UL https://suche.suub.uni-bremen.de/peid=ieee-10564877&Exemplar=1&LAN=DE A1 Mandalapu, Chandra Sekhar A1 Buch, Chintan A1 Shah, Priyal A1 Topacio, Roden A1 Cheng, Patrick A1 Wang, Liwei A1 Swaminathan, Raja A1 Smith, Alan A1 Wuu, John A1 Mysore, Kaushik A1 Alam, Arsalan YR 2024 SN 2377-5726 K1 Cooling K1 Memory management K1 Multichip modules K1 Metals K1 Electronic components K1 Bandwidth K1 Learning (artificial intelligence) K1 Advanced packaging K1 High bandwidth memory (HBM) K1 Hybrid bonding K1 Metal TIM K1 MI300X Instinct™ K1 Passives K1 Reliability K1 Silicon interposer K1 3.5D Packaging SP 798 OP 802 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00391 DO https://doi.org/10.1109/ECTC51529.2024.00391 SF ELIB - SuUB Bremen
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