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1 Ergebnisse
1
600mm x 600mm Fan-Out Panel Level Package (FOPLP) as an Alt..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Lim, Jacinta Aman
;
Lee, Jane
;
Shin, Hyun-Jin
... - p. 16-22 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00011
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>600mm x 600mm Fan-Out Panel Level Package (FOPLP) as an Alternative to Lead-Frame-Free Quad Flat No Lead (QFN) Package</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10564879&Exemplar=1&LAN=DE A1 Lim, Jacinta Aman A1 Lee, Jane A1 Shin, Hyun-Jin A1 Park, YunMook A1 Davis, Robin A1 Lee, YoungMo A1 Dunlap, Brett YR 2024 SN 2377-5726 K1 Resistance K1 Strips K1 Semiconductor device measurement K1 Reviews K1 Wires K1 Supply chains K1 Bills of materials K1 Leadframe-free QFN K1 Fan-Out Panel Level Packaging K1 600mm x 600mm FOPLP K1 laser direct imaging K1 wettable flank K1 QFN alternative SP 16 OP 22 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00011 DO https://doi.org/10.1109/ECTC51529.2024.00011 SF ELIB - SuUB Bremen
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