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1 Ergebnisse
1
New Method of Creating Through Silicon Vias for Next Genera..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Nelson, Zachary
;
Mo, Alice
;
Theogarajan, Luke
- p. 2189-2193 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00372
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>New Method of Creating Through Silicon Vias for Next Generation Packaging Techniques</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10564881&Exemplar=1&LAN=DE A1 Nelson, Zachary A1 Mo, Alice A1 Theogarajan, Luke YR 2024 SN 2377-5726 K1 Three-dimensional displays K1 Metallization K1 Ink K1 Packaging K1 Silicon K1 Filling K1 Metallurgy K1 3D integration K1 through silicon vias (TSV) K1 silver ink K1 packaging SP 2189 OP 2193 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00372 DO https://doi.org/10.1109/ECTC51529.2024.00372 SF ELIB - SuUB Bremen
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