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1 Ergebnisse
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Observation of Thermal Expansion Behavior of Nanotwinned-Cu..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Lin, Huai-En
;
Chiu, Wei-Lan
;
Chang, Hsiang-Hung
. - p. 816-820 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00131
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Observation of Thermal Expansion Behavior of Nanotwinned-Cu/SiO2 & Regular-Cu/SiO2 Hybrid Structure via In-Situ Heating AFM</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10564884&Exemplar=1&LAN=DE A1 Lin, Huai-En A1 Chiu, Wei-Lan A1 Chang, Hsiang-Hung A1 Chen, Chih YR 2024 SN 2377-5726 K1 Temperature measurement K1 Heating systems K1 Silicon compounds K1 Atomic force microscopy K1 Temperature K1 Deformation K1 Thermal force K1 In-situ heating AFM K1 Cu/SiO2 hybrid bonding K1 Nanotwinned Cu K1 Coefficient of thermal expansion K1 3D IC SP 816 OP 820 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00131 DO https://doi.org/10.1109/ECTC51529.2024.00131 SF ELIB - SuUB Bremen
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