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1 Ergebnisse
1
Integrated Design Ecosystem for Chiplets Heterogeneous Inte..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Cao, Lihong
;
Wang, Chen-Chao
;
Huang, Chih-Yi
. - p. 1048-1053 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00168
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Integrated Design Ecosystem for Chiplets Heterogeneous Integration and Chip-to-Chip Interconnects in Advanced Packaging Technology</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10564890&Exemplar=1&LAN=DE A1 Cao, Lihong A1 Wang, Chen-Chao A1 Huang, Chih-Yi A1 Kuo, Hung-Chun YR 2024 SN 2377-5726 K1 Turnkey project K1 Ecosystems K1 Integrated design K1 Silicon K1 Planning K1 Design tools K1 Through-silicon vias K1 Chiplets integration K1 Integrated Design Ecosystem (IDE) K1 Fanout RDL interposer K1 2.5D Si TSV interposer K1 FOCoS (Fanout Chip on Substrate) K1 Universal Chiplet Interconnect Express (UCIe) K1 die to die interconnect K1 Warpage K1 Mechanical analysis SP 1048 OP 1053 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00168 DO https://doi.org/10.1109/ECTC51529.2024.00168 SF ELIB - SuUB Bremen
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