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1 Ergebnisse
1
Influence of Temporary Rigid Carrier Structure on Warpage d..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Matsuura, Yoshinori
;
Kuwahara, Kyohei
;
Kitabakake, Yukiko
... - p. 2047-2052 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00349
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Influence of Temporary Rigid Carrier Structure on Warpage during Wafer/Panel level packaging</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10564894&Exemplar=1&LAN=DE A1 Matsuura, Yoshinori A1 Kuwahara, Kyohei A1 Kitabakake, Yukiko A1 Yanai, Takenori A1 Koide, Masahiro A1 Fujii, Joji YR 2024 SN 2377-5726 K1 Thermal expansion K1 Limiting K1 Lamination K1 Curing K1 Packaging K1 Thermal conductivity K1 Polymers K1 Carrier substrate technology K1 Coefficient of thermal expansion (CTE) K1 Warpage control K1 Finite Element Analysis (FEA) K1 High Resolution Debondable Panel (HRDPp SP 2047 OP 2052 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00349 DO https://doi.org/10.1109/ECTC51529.2024.00349 SF ELIB - SuUB Bremen
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