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1 Ergebnisse
1
Low Temperature Cu/SiO2 Hybrid Bonding with Protruding Copp..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Fang, Jun-Peng
;
Wang, Qian
;
Yu, Jie-Xun
... - p. 1911-1915 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00323
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Low Temperature Cu/SiO2 Hybrid Bonding with Protruding Copper Pads</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10564908&Exemplar=1&LAN=DE A1 Fang, Jun-Peng A1 Wang, Qian A1 Yu, Jie-Xun A1 Wang, Zi-Qing A1 Zhou, Yi-Kang A1 Zheng, Kai A1 Cai, Jian YR 2024 SN 2377-5726 K1 Temperature measurement K1 Atomic measurements K1 Scanning electron microscopy K1 Surface morphology K1 Surface roughness K1 Surface topography K1 Rough surfaces K1 Cu/SiO2 hybrid bonding K1 Low temperature K1 Protruding Cu pads SP 1911 OP 1915 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00323 DO https://doi.org/10.1109/ECTC51529.2024.00323 SF ELIB - SuUB Bremen
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