Titel

Merkliste
1 Ergebnisse

IR Laser Release for 3D Stacked Devices: Effect of the Rele..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),

Chancerel, Francois ; Urban, Peter ; Slabbekoorn, John... - p. 343-347 , 2024

Link: https://doi.org/10.1109/ECTC51529.2024.00063

RT 
T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>IR Laser Release for 3D Stacked Devices: Effect of the Release Stack Structure on the Debonding Mechanism</Title>

UL https://suche.suub.uni-bremen.de/peid=ieee-10564911&Exemplar=1&LAN=DE
				
A1 Chancerel, Francois
A1 Urban, Peter
A1 Slabbekoorn, John
A1 Halas, Simon
A1 Bravin, Julian
A1 Brems, Steven
A1 Uhrmann, Thomas
A1 Wimplinger, Markus
A1 Phommahaxay, Alain
A1 Beyne, Eric
YR 2024
SN 2377-5726
K1 Three-dimensional displays
K1 Surface emitting lasers
K1 Cleaning
K1 Laser ablation
K1 Structural engineering
K1 Mirrors
K1 Surface cracks
K1 IR laser release
K1 temporary bonding
K1 fusion bonding
K1 W2W bonding
K1 D2W bonding
K1 hybrid bonding
K1 Heterogeneous integration
K1 wafer bonder
K1 dielectric bonding
K1 material
K1 laser debonding
K1 thin wafer processing
SP 343
OP 347
LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00063
DO https://doi.org/10.1109/ECTC51529.2024.00063
SF ELIB - SuUB Bremen

Export

RefWorks (nur Desktop-Version!)
Flow (Zuerst in Flow einloggen, dann importieren)