I agree that this site is using cookies. You can find further informations
here
.
X
Login
Merkliste (
0
)
Home
About us
Home About us
Our history
Profile
Press & public relations
Friends
The library in figures
Exhibitions
Projects
Training, internships, careers
Films
Services & Information
Home Services & Information
Lending and interlibrary loans
Returns and renewals
Training and library tours
My Account
Library cards
New to the library?
Download Information
Opening hours
Learning spaces
PC, WLAN, copy, scan and print
Catalogs and collections
Home Catalogs and Collections
Rare books and manuscripts
Digital collections
Subject Areas
Our sites
Home Our sites
Central Library
Law Library (Juridicum)
BB Business and Economics (BB11)
BB Physics and Electrical Engineering
TB Engineering and Social Sciences
TB Economics and Nautical Sciences
TB Music
TB Art & Design
TB Bremerhaven
Contact the library
Home Contact the library
Staff Directory
Open access & publishing
Home Open access & publishing
Reference management: Citavi & RefWorks
Publishing documents
Open Access in Bremen
zur Desktop-Version
Toggle navigation
Merkliste
1 Ergebnisse
1
Impact of Current induced Joule heating variation on long-t..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Lee, Tae-Kyu
;
Park, Yujin
;
Ramakrishna, Gnyaneshwar
... - p. 1439-1444 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00234
RT T1
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
: T1
Impact of Current induced Joule heating variation on long-term Low melting temperature solder joint stability
UL https://suche.suub.uni-bremen.de/peid=ieee-10564913&Exemplar=1&LAN=DE A1 Lee, Tae-Kyu A1 Park, Yujin A1 Ramakrishna, Gnyaneshwar A1 Gothe, Pushkar A1 Lee, Young-Woo A1 Kim, Hui-Joong A1 Lee, Seul-Gi A1 Kim, Choong-Un YR 2024 SN 2377-5726 K1 Temperature measurement K1 Heating systems K1 Temperature distribution K1 Metals K1 Integrated circuit interconnections K1 Hybrid power systems K1 Soldering K1 Current stressing K1 Low melting temperature solder K1 microstructure K1 Joule heating K1 PCB SP 1439 OP 1444 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00234 DO https://doi.org/10.1109/ECTC51529.2024.00234 SF ELIB - SuUB Bremen
Export
RefWorks (nur Desktop-Version!)
Flow
(Zuerst in
Flow
einloggen, dann importieren)