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1 Ergebnisse
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Impact of Current induced Joule heating variation on long-t..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Lee, Tae-Kyu
;
Park, Yujin
;
Ramakrishna, Gnyaneshwar
... - p. 1439-1444 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00234
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Impact of Current induced Joule heating variation on long-term Low melting temperature solder joint stability</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10564913&Exemplar=1&LAN=DE A1 Lee, Tae-Kyu A1 Park, Yujin A1 Ramakrishna, Gnyaneshwar A1 Gothe, Pushkar A1 Lee, Young-Woo A1 Kim, Hui-Joong A1 Lee, Seul-Gi A1 Kim, Choong-Un YR 2024 SN 2377-5726 K1 Temperature measurement K1 Heating systems K1 Temperature distribution K1 Metals K1 Integrated circuit interconnections K1 Hybrid power systems K1 Soldering K1 Current stressing K1 Low melting temperature solder K1 microstructure K1 Joule heating K1 PCB SP 1439 OP 1444 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00234 DO https://doi.org/10.1109/ECTC51529.2024.00234 SF ELIB - SuUB Bremen
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