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Integration of planarized Nb-based vias to form a multi-lev..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Thomas, Candice
;
Deschaseaux, Edouard
;
Velard, Remi
... - p. 809-815 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00130
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Integration of planarized Nb-based vias to form a multi-level superconducting back-end-of-line</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10564915&Exemplar=1&LAN=DE A1 Thomas, Candice A1 Deschaseaux, Edouard A1 Velard, Remi A1 Romano, Giovanni A1 Michel, Jean-Philippe A1 Vivien, Norman A1 Souil, Richard A1 Beluffi, Cassandre A1 Guignard, Simon A1 Pellissier, Catherine A1 Charbonnier, Jean YR 2024 SN 2377-5726 K1 Temperature measurement K1 Radio frequency K1 Temperature K1 Magnetic field measurement K1 Current measurement K1 Tin K1 Superconducting epitaxial layers K1 vias K1 back-end-of-line K1 superconductors K1 quantum systems SP 809 OP 815 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00130 DO https://doi.org/10.1109/ECTC51529.2024.00130 SF ELIB - SuUB Bremen
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