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1 Ergebnisse
1
Electromigration in Eutectic Tin-Bismuth Bottom-Terminated-..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Singh, P.
;
Palmer, L.
;
Wassick, T.
... - p. 1433-1438 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00233
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Electromigration in Eutectic Tin-Bismuth Bottom-Terminated-Component Solder Joints</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10564921&Exemplar=1&LAN=DE A1 Singh, P. A1 Palmer, L. A1 Wassick, T. A1 Aspandiar, R. F. A1 Franco, B. A1 Fu, H. A1 Vasudevan, V. A1 Allen, A. A1 Howell, K. A1 Murayama, K. A1 Zhang, H. A1 Lifton, A. A1 Munson, T. A1 Middleton, S. A1 Coyle, R. A1 Murali, S. YR 2024 SN 2377-5726 K1 Electromigration K1 Temperature K1 Shape K1 Metallization K1 Surface resistance K1 Bismuth K1 Nickel K1 electromigration K1 tin-bismuth solder alloys K1 bottom-terminated components SP 1433 OP 1438 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00233 DO https://doi.org/10.1109/ECTC51529.2024.00233 SF ELIB - SuUB Bremen
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