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1 Ergebnisse
1
Embedded cooling method with monolithic dual-layer microcha..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Du, Jianyu
;
Wu, Hongxu
;
Yu, Huaiqiang
.. - p. 1619-1622 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00266
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Embedded cooling method with monolithic dual-layer microchannel cold plate for high-power chips</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10564923&Exemplar=1&LAN=DE A1 Du, Jianyu A1 Wu, Hongxu A1 Yu, Huaiqiang A1 Zhang, Chi A1 Wang, Wei YR 2024 SN 2377-5726 K1 Thermal management of electronics K1 Manifolds K1 Cooling K1 Cold plates K1 Thermal resistance K1 Thermal management K1 Heat transfer K1 thermal management K1 microchannel K1 MEMS K1 embedded cooling SP 1619 OP 1622 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00266 DO https://doi.org/10.1109/ECTC51529.2024.00266 SF ELIB - SuUB Bremen
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