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1 Ergebnisse
1
Ultra Thin Fan-Out 3D WLCSP Heterogeneous Integration Packa..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Li, Jay
;
Zhang, Zen-Wei
;
Lin, Vito
... - p. 2107-2111 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00359
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Ultra Thin Fan-Out 3D WLCSP Heterogeneous Integration Packaging</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10564924&Exemplar=1&LAN=DE A1 Li, Jay A1 Zhang, Zen-Wei A1 Lin, Vito A1 Lin, Sam A1 Shih, Teny A1 Kao, Nicholas A1 Wang, Yu-Po YR 2024 SN 2377-5726 K1 Three-dimensional displays K1 Costs K1 Lapping K1 Blades K1 Stacking K1 Multichip modules K1 Process control K1 Heterogeneous integration K1 FO-3D K1 WLCSP K1 RDL K1 Warpage control SP 2107 OP 2111 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00359 DO https://doi.org/10.1109/ECTC51529.2024.00359 SF ELIB - SuUB Bremen
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