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1 Ergebnisse
1
An Advanced Packaging Figure of Merit (AP-FoM) for Benchmar..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Wang, Chuei-Tang
;
Shang, Shu-An
;
Hsiao, Yu-Ming
... - p. 1093-1097 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00175
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>An Advanced Packaging Figure of Merit (AP-FoM) for Benchmarking of Heterogeneous Integration Technologies</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10564937&Exemplar=1&LAN=DE A1 Wang, Chuei-Tang A1 Shang, Shu-An A1 Hsiao, Yu-Ming A1 Lii, Mirng-Ji A1 Lee, Kam Heng A1 He, Jun YR 2024 SN 2377-5726 K1 Costs K1 Multichip modules K1 Metals K1 Bandwidth K1 Benchmark testing K1 Jitter K1 Silicon K1 Figure-of-Merit K1 Package K1 CoWoS K1 HPC K1 AI K1 UCIe K1 HBM SP 1093 OP 1097 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00175 DO https://doi.org/10.1109/ECTC51529.2024.00175 SF ELIB - SuUB Bremen
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