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1 Ergebnisse
1
A Study on the Surface Activation of Plasma Treatment for H..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Hsu, Chih-Jing
;
Fang, Hsu-Nan
;
Su, Tzu-Yu
... - p. 1826-1829 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00305
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>A Study on the Surface Activation of Plasma Treatment for Hybrid Bonding Joint Interface</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10564942&Exemplar=1&LAN=DE A1 Hsu, Chih-Jing A1 Fang, Hsu-Nan A1 Su, Tzu-Yu A1 Jiang, Zhao-Ze A1 Chen, Yi-Hua A1 Chen, Chien-Ching A1 Hsu, Che-Ming A1 Tsai, Yu-Pin A1 Chiang, Yuan-Feng A1 Kao, Jen-Chieh A1 Yeh, Yung-I YR 2024 SN 2377-5726 K1 Industries K1 Microscopy K1 Force K1 Fluid flow K1 Market research K1 Plasmas K1 Bonding K1 Hybrid bonding K1 CFM K1 Plasma treatment K1 CoW SP 1826 OP 1829 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00305 DO https://doi.org/10.1109/ECTC51529.2024.00305 SF ELIB - SuUB Bremen
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