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1 Ergebnisse
1
Development of magnetic molding compound for low pressure m..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Sonokawa, Hiroki
;
Tanaka, Mika
;
Endo, Yoshinori
.. - p. 887-892 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00143
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Development of magnetic molding compound for low pressure molding inductors with both good magnetic properties and high reliability</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10564946&Exemplar=1&LAN=DE A1 Sonokawa, Hiroki A1 Tanaka, Mika A1 Endo, Yoshinori A1 Ito, Teruo A1 Inagaki, Takashi YR 2024 SN 2377-5726 K1 Encapsulation K1 Presses K1 Powders K1 Magnetomechanical effects K1 Toroidal magnetic fields K1 Amorphous magnetic materials K1 Permeability K1 Encapsulation technology K1 Transfer mold K1 magnetic property K1 reliability test K1 thermosetting resin (key words) SP 887 OP 892 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00143 DO https://doi.org/10.1109/ECTC51529.2024.00143 SF ELIB - SuUB Bremen
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