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1 Ergebnisse
1
Packaged Tunable Single Mode III-V Laser Hybrid Integrated ..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Deenadayalan, Venkatesh
;
Thornton, Eric
;
Nelson, George T.
... - p. 1387-1391 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00226
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Packaged Tunable Single Mode III-V Laser Hybrid Integrated on a Silicon Photonic Integrated Chip using Photonic Wire Bonding</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10564948&Exemplar=1&LAN=DE A1 Deenadayalan, Venkatesh A1 Thornton, Eric A1 Nelson, George T. A1 McGarvey, Peter A1 King, Jonathan D A1 Patel, Jill A1 Bickford, Justin A1 Mitchell, Matthew A1 Chrostowski, Lukas A1 Shekhar, Sudip A1 Kemal, Juned N. A1 Skacel, Sebastian Tobias A1 Ciminelli, Mario A1 Preble, Stefan YR 2024 SN 2377-5726 K1 Electronic components K1 Silicon photonics K1 Laser modes K1 Electronic packaging thermal management K1 Wire K1 Laser tuning K1 Bonding K1 Photonic Wire Bonding K1 Lasers K1 Integration K1 Tuning K1 Thermal SP 1387 OP 1391 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00226 DO https://doi.org/10.1109/ECTC51529.2024.00226 SF ELIB - SuUB Bremen
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