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1 Ergebnisse
1
Hybrid Bonding Technology: Chemical Mechanical Planarizatio..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Jiang, L.
;
Bazizi, E. M.
;
Costrini, G.
... - p. 1808-1813 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00302
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Hybrid Bonding Technology: Chemical Mechanical Planarization Process Optimization Using Comprehensive 3D Modeling</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10564950&Exemplar=1&LAN=DE A1 Jiang, L. A1 Bazizi, E. M. A1 Costrini, G. A1 Lianto, P. A1 See, G. A1 Tsamados, D. A1 Saad, Y. A1 Dag, S. A1 Mehta, G. A1 Yang, Y. C. A1 Sundarrajan, A. A1 Kengeri, S. YR 2024 SN 2377-5726 K1 Semiconductor device modeling K1 Solid modeling K1 Three-dimensional displays K1 Planarization K1 Layout K1 Electronic components K1 Data models K1 Hybrid bonding K1 Chemical-Mechanical Planarization K1 Dielectric Erosion K1 Dielectric Rounding K1 Copper Dishing K1 Fiducial Pattern SP 1808 OP 1813 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00302 DO https://doi.org/10.1109/ECTC51529.2024.00302 SF ELIB - SuUB Bremen
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