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1 Ergebnisse
1
Characterization of a Piezoresistive Sensor for In-Situ Hea..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Inamdar, Adwait
;
Thukral, Varun
;
Zhang, Letian
... - p. 157-163 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00035
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Characterization of a Piezoresistive Sensor for In-Situ Health Monitoring of Solder Bumps</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10564953&Exemplar=1&LAN=DE A1 Inamdar, Adwait A1 Thukral, Varun A1 Zhang, Letian A1 Zaal, Jeroen J. M. A1 Van Soestbergen, Michiel A1 Tuinhout, Hans A1 Van Driel, Willem D. A1 Zhang, GuoQi YR 2024 SN 2377-5726 K1 Mechanical sensors K1 Loading K1 Electronic components K1 Sensor phenomena and characterization K1 Thermal loading K1 Reliability K1 Soldering K1 solder joints K1 fatigue cracking K1 piezoresistive sensor K1 degradation monitoring K1 board-level reliability SP 157 OP 163 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00035 DO https://doi.org/10.1109/ECTC51529.2024.00035 SF ELIB - SuUB Bremen
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