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1 Ergebnisse
1
Challenges and Innovations in Dual Damascene Polymer RDL wi..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Briggs, Benjamin D.
;
Ley, Ryan
;
Bencher, Chris
... - p. 571-575 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00096
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Challenges and Innovations in Dual Damascene Polymer RDL with 2 μm Pitch and Beyond</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10564958&Exemplar=1&LAN=DE A1 Briggs, Benjamin D. A1 Ley, Ryan A1 Bencher, Chris A1 Quon, Roger A1 Chuang, C C A1 Suo, Peng A1 Bum Yong, Andy Chang A1 Bozano, Luisa A1 Fernandez, Jorge A1 Lianto, Prayudi A1 Khasgiwale, Niranjan A1 Krishnan, Siddarth YR 2024 SN 2377-5726 K1 Resistance K1 Technological innovation K1 Costs K1 Scalability K1 Lithography K1 Semiconductor device reliability K1 Resists K1 RDL K1 Dual Damascene K1 Fan-out K1 Chiplet K1 FOWLP K1 Heterogenous Integration SP 571 OP 575 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00096 DO https://doi.org/10.1109/ECTC51529.2024.00096 SF ELIB - SuUB Bremen
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