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1 Ergebnisse
1
Optimization of Core Material Properties for Large Flip-chi..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Noma, Hirokazu
;
Takahashi, Masaki
;
Hatakeyama, Nene
... - p. 1613-1618 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00265
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Optimization of Core Material Properties for Large Flip-chip Ball Grid Array Substrate to Manage Both Warpage and Board Level Reliability</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10564960&Exemplar=1&LAN=DE A1 Noma, Hirokazu A1 Takahashi, Masaki A1 Hatakeyama, Nene A1 Yanaka, Yuichi A1 Fukui, Akito A1 Johno, Keita A1 Onozeki, Hitoshi YR 2024 SN 2377-5726 K1 Ball grid arrays K1 Thermal expansion K1 Fiber reinforced plastics K1 Electronic packaging thermal management K1 Silicon K1 Flip-chip devices K1 Resins K1 2.5D package K1 temperature cycling K1 solder joint crack K1 fatigue life K1 coefficient of thermal expansion K1 Young's modulus K1 copper clad laminate K1 glass fiber reinforced plastic SP 1613 OP 1618 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00265 DO https://doi.org/10.1109/ECTC51529.2024.00265 SF ELIB - SuUB Bremen
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