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1 Ergebnisse
1
Fluidic Self Alignment for Hybrid Bonding Using Intel Proce..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Eid, Feras
;
Shi, Y.
;
Naderi, G.
... - p. 2037-2041 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00347
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Fluidic Self Alignment for Hybrid Bonding Using Intel Process</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10564962&Exemplar=1&LAN=DE A1 Eid, Feras A1 Shi, Y. A1 Naderi, G. A1 Sinha, S-B A1 Jordan, R. A1 Li, W. A1 El Helou, C. A1 Bedoya, F. A1 Roy, A. A1 Mahdi, T. A1 Chen, J-R A1 Rawlings, B. A1 Barley, B. A1 Benson, S. A1 Baker, M. A1 Myers, P. A1 Allen, M. A1 Lopez, A. A1 Saucedo, J. A1 Minn, K. A1 Dong, S. A1 Bielefeld, J. A1 Vreeland, R. A1 Brezinski, W A1 Olmos, F. A1 Woods, C. A1 Swan, J. YR 2024 SN 2377-5726 K1 Semiconductor device modeling K1 Liquids K1 Sensitivity K1 Microscopy K1 Throughput K1 Numerical models K1 Bonding K1 hybrid bonding K1 self assembly K1 capillary K1 fluidic alignment K1 high throughput SP 2037 OP 2041 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00347 DO https://doi.org/10.1109/ECTC51529.2024.00347 SF ELIB - SuUB Bremen
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