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1 Ergebnisse
1
Vertical Fan Out(VFO) package with enhanced form factor and..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Sung, Ki-Jun
;
Eun, Kyoungtae
;
Kim, Jae-Min
... - p. 34-39 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00014
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Vertical Fan Out(VFO) package with enhanced form factor and performances for mobile applications</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10564973&Exemplar=1&LAN=DE A1 Sung, Ki-Jun A1 Eun, Kyoungtae A1 Kim, Jae-Min A1 Jang, Se-Hyun A1 Lee, Seowon A1 Yoon, Sungwon A1 Kim, Jongkwan A1 Kim, Minsuk A1 Yun, Jiyeong A1 Ju, Jeongho A1 Son, Ho-Young A1 Lee, Kang-Wook YR 2024 SN 2377-5726 K1 Fans K1 Temperature K1 System performance K1 Electromagnetic interference K1 Wires K1 Packaging K1 Mobile applications K1 Vertical wire K1 Vertical Fan Out K1 VFO K1 FOWLP K1 Memory Fan Out SP 34 OP 39 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00014 DO https://doi.org/10.1109/ECTC51529.2024.00014 SF ELIB - SuUB Bremen
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