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1 Ergebnisse
1
A Novel DC-DC Converter Module Using the integrated Package..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Yamada, Shuhei
;
Adachi, Nobuyoshi
;
Itoyama, Kazuki
... - p. 1060-1063 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00170
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>A Novel DC-DC Converter Module Using the integrated Package Solution (iPaS) Substrate for Next Generation High Performance Computing (HPC) Applications</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10564977&Exemplar=1&LAN=DE A1 Yamada, Shuhei A1 Adachi, Nobuyoshi A1 Itoyama, Kazuki A1 Yonemori, Keito A1 Kitamura, Tatsuya A1 Himeda, Koshi A1 Yamamoto, Atsushi YR 2024 SN 2377-5726 K1 Transient response K1 Power demand K1 High performance computing K1 Capacitors K1 DC-DC power converters K1 Packaging K1 Inductors K1 iPaS K1 low impedance substrate K1 embedded capacitor K1 power delivery network K1 vertical power delivery K1 DC-DC converter module SP 1060 OP 1063 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00170 DO https://doi.org/10.1109/ECTC51529.2024.00170 SF ELIB - SuUB Bremen
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