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1 Ergebnisse
1
High Acceleration Dynamic Methodology for Board-Level Shock..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Yu, Min-Cheng
;
Wu, Nan-Yi
;
Wang, Wu-Lung
... - p. 1213-1218 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00195
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>High Acceleration Dynamic Methodology for Board-Level Shock Solder Joint Reliability Approach</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10564983&Exemplar=1&LAN=DE A1 Yu, Min-Cheng A1 Wu, Nan-Yi A1 Wang, Wu-Lung A1 Shih, Hsin-Chih A1 Lai, Wei-Hong A1 Kao, Chin-Li A1 Wang, Chen-Chao A1 Hung, C P YR 2024 SN 2377-5726 K1 Damping K1 Photography K1 Analytical models K1 Accuracy K1 Electric shock K1 Dynamics K1 Strain measurement K1 board level shock reliability test K1 viscous damping system K1 PCB dynamic response K1 high speed photography technology K1 ANSYS_LS-DYNA SP 1213 OP 1218 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00195 DO https://doi.org/10.1109/ECTC51529.2024.00195 SF ELIB - SuUB Bremen
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