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1 Ergebnisse
1
Block level and package level thermal assessment for back s..:
, In:
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
,
Lofrano, Melina
;
Oprins, Herman
;
Cherman, Vladimir
... - p. 1036-1043 , 2024
Link:
https://doi.org/10.1109/ECTC51529.2024.00166
RT T1 <cTitle>2024 IEEE 74th Electronic Components and Technology Conference (ECTC)</cTitle>: T1 <Title>Block level and package level thermal assessment for back side power delivery network</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10564988&Exemplar=1&LAN=DE A1 Lofrano, Melina A1 Oprins, Herman A1 Cherman, Vladimir A1 Witters, Lisbeth A1 Jourdain, Anne A1 Van der Plas, Geert A1 Beyne, Eric YR 2024 SN 2377-5726 K1 Temperature sensors K1 Temperature measurement K1 Temperature dependence K1 Cooling K1 Thermal resistance K1 Metals K1 Predictive models K1 Backside power delivery network K1 multi scale modeling K1 package level K1 block level K1 hotspot heat source SP 1036 OP 1043 LK http://dx.doi.org/https://doi.org/10.1109/ECTC51529.2024.00166 DO https://doi.org/10.1109/ECTC51529.2024.00166 SF ELIB - SuUB Bremen
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